Usage detail
High frequency PCB materials, Insulating films
Usage
Characteristic
- Basic Information
Concept
Gigafreq™ has COC's properties and heat resistance by cross linking.
Properties
Heat resistance
Dielectric property
Applications
High frequency PCB materials
Insulating films
Prepreg (pre-polymer with glass cloth)
Pre-polymer varnish and Cross-linked film
Properties Table
| Properties | Unit | Gigafreq™ | |
|---|---|---|---|
| Resin type | Thermosetting | ||
| Dielectric properties | Dk (10GHz) | - | 2.3 |
| Df (10GHz) | - | 0.0013 | |
| CTE(TMA)/30-300℃ | ppm/K | 87(<Tg) 212(>Tg) |
|
| Heat resistance of solder process | 288℃ 5mins |
OK | |
| 5% weight loss temp(td5) | ℃ | >400 | |
| Storage Modulus(288℃) | Pa | >1.0E+07 | |
| Tensile strength | MPa | 62 | |
| Elongation | % | 3.8 | |
| Water absorption | % | <0.01 | |
Contact Us
ICT Materials Business Division