Usage detail
High frequency PCB materials, Insulating films
Usage
Characteristic
- Basic Information
Concept
Gigafreq™ has COC's properties and heat resistance by cross linking.


Properties
Heat resistance

Dielectric property

Applications
High frequency PCB materials
Insulating films
Prepreg (pre-polymer with glass cloth)

Pre-polymer varnish and Cross-linked film

Properties Table
Properties | Unit | Gigafreq™ | |
---|---|---|---|
Resin type | Thermosetting | ||
Dielectric properties | Dk (10GHz) | - | 2.3 |
Df (10GHz) | - | 0.0013 | |
CTE(TMA)/30-300℃ | ppm/K | 87(<Tg) 212(>Tg) |
|
Heat resistance of solder process | 288℃ 5mins |
OK | |
5% weight loss temp(td5) | ℃ | >400 | |
Storage Modulus(288℃) | Pa | >1.0E+07 | |
Tensile strength | MPa | 62 | |
Elongation | % | 3.8 | |
Water absorption | % | <0.01 |
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