Struct Bond™

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Struct Bond™ Relevant Products

Functional adhesive

Sheet type sealant

Thin film encapsulation

Applications detail

Sealant, Display (LCD)

Applications

Other (Home appliances, IT devices)

Bonding agents, tackifier

Characteristics

Basic information
Details of Characteristics
Details of Applications

Overview

A sealing material (single-component adhesive) for displays. The lineup includes a heat-curing type and combination UV + heat-curing type.

Low moisture permeability

Possesses excellent moisture permeability and high reliability.

High adhesive strength

In addition to high adhesion to inorganic materials such as glass, the material also displays good adhesion to organic materials such as organic films.

Low liquid crystal pollution

Shows minimal elution of components into liquid crystal and good liquid crystal panel display properties.

Various manufacturing processes

Various manufacturing processes including screen printing and dispensers are supported.

Long pot life

Excellent viscosity stability at room temperature ensures a long working life.

Heat-cured sealant for injection process

UV + heat-cured sealant for one drop fill (ODF)

Details of properties

		Heat-cured sealant for LCD		UV+heat-cured sealant for LCD		Appendix
Resin type		With solvent Epoxy		Without solvent Acryl + Epoxy		-
Curing process		90℃ 10min + 150℃ 60min		UV3,000mJ/cm² + 120℃ 60min		-
Grade		Standard	High reliability	Standard	High adhesion	-
Viscosity	Pa・s	20	30	300	300	E-type viscometer 2.5rpm 25℃
Viscosity rising rate	times	1.7	1.3	1.1	1.1	Compared with initial viscosity after 7days at 23℃
TI value	-	1.2	1.1	1.1	1.1	1.0/10 rpm vis. ratio
Adhesive strength	N/mm	20	18	21	25	Line width 0.5mm on Glass
Tg^*	℃	120	170	100	90	DMA measurement
Moisture permeability （WVTR）	g/m²	60	50	80	80	60℃×90RH%, 24hrs 100µmT film