Dust covers for photomasks (MITSUI PELLICLE™), silane/disilane,
soluble polyimide varnish (PIVAR™), high frequency printed circuit board material (Gigafreq™),
resist raw material (MILEX™), piezoelectric material (PIEZOLA™),
semiconductor manufacturing process tapes (ICROS™ Tape),
silicone-coated film (SP-PET™), heat-resistant release film (Opulent™)
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ICT Solutions
Business vision (Our ideal
vision for 2030)
Creating and growing a “unique” ICT Solutions business that contributes to the
evolution of AI, beyond-5G, and other such technologies that can support safe and
pleasant infrastructure, healthy living, and a sustainable global environment
Main Products
Semiconductor & assembly solutions
Pick UpMITSUI PELLICLE™ : World-leading dust cover for Photomask
Employed in the exposure process that facilitates the production of semiconductors, LCD panels and more, photomask pellicles serve as a protective cover for intricately patterned photomasks, preventing dust from attaching to the photomask and affecting the imaging on the silicon wafer or glass substrate.
We contribute to customers' productivity improvement not only by designing materials and products, but also by providing services based on our experience and technology.
Imaging solutions
Lens materials (APEL™ ), materials for reflective films (TPX™ ),
LCD and OLED sealing materials (STRUCTBOND™ )
Pick UpAPEL™ : Transparent resin for high performance lenses
APEL™ is a cyclic olefin copolymer used in the camera lenses of smartphones. With a high refractive index and low birefringence, APEL™ can be used in place of glass for optical lens applications, facilitating the design of smaller, lighter products
APEL™ also has excellent moisture-proof properties, resistance to chemicals and non-attachment characteristics, it is used for medical packaging material.
Semiconductor & assembly solutions
Capacitator material (TPX™), materials for LiB separator (HI-ZEX MILLION™),
electrolyte for LiB (MILLET™), adhesive for LiB pouch (UNISTOLE™), heat resistant coating material (BONRON™)
Converting solutions
heat sealant for environmentally friendly paper packaging materials (CHEMIPEARL™),
barrier coating materials ( TAKELAC™ WPB ), packaging adhesives (TAKENATE™ & TAKELAC™)
Pick UpCHEMIPEARL™ : Polyolefin-based Aqueous Dispersion
CHEMIPEARL™ is a polyolefin-based aqueous dispersion developed by Mitsui Chemicals' unique technology.
It provides heat-sealing property, water-resistance and oil-resistance to paper by coating and could be used for various types of paper packaging material including food packaging.
CHEMIPEARL™ coated paper can reduce usage of plastic and it is easily crushable and becoming pulp slurry compared to PE-laminated paper.
Major Group Company
Mitsui Chemicals ICT Materia, Inc.
Mitsui Chemicals ICT Materia, Inc., produces a wide array of films and sheets that contribute to the ICT field, including semiconductor and electronic components and solar cell components. Leveraging the comprehensive strengths of the Mitsui Chemicals Group, we want to enhance technological innovation and cost competitiveness by means of an integrated system encompassing all aspects from raw resin to film and sheet processing, and propose valuable solutions.