A thermo-cured sheet-type sealing material with excellent transparency, heat resistance and flexibility that has the gap-filling performance with a thin film.
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Struct Bond™
Sheet type sealant
Struct Bond™ Relevant Products
Applications detail
flexible electronic devices
Applications
Characteristics
- Basic information
- Details of Characteristics
- Details of Applications
Overview
Struct Bond™ sheet type sealant is a heat-cured material with excellent transparency, heat resistance and flexibility that has the gap-filling performance with a thin film.
The material has been well received and used for displays and various other flexible electronic devices.
The lineup includes two types, a high-transparency clear type, and a haze type that is able to equalize the distribution of emitted light.
Mitsui Chemicals can also develop proposals for use of the material in trial production environments and facilities, as well as in combination with related processed materials in response to customer requests.
Thin film / Gap filling Performance: 15µm film thickness
Gaps can be filled in even at a thin adhesive film thicknesses of 15μm.
Cross section of unevenness-followability
Transparency （clear type）: total light transmittance of 99% or higher
Due to its excellent transparency, the material can be applied to optical devices.
Haze properties （haze type）: Haze of 80% or higher （total light transmittance of 90% or higher）
Due to its high haze properties, the material can be used as an adhesive for devices that need to equalize the distribution of emitted light.
Bending test over 200,000 times （adhesive alone after curing, radius of curvature of 3mm）
Due to its excellent flexibility, the material can be applied to flexible devices.
Glass transition temperature of 90ºC or higher
The material has superior heat resistance to a tacky adhesive, making it able to stand up to harsh reliability tests.
WVTR： 35g/m2/day or less *Thickness 100µm, 60℃/90%RH
With its excellent low moisture permeability, the material can be applied to devices susceptible to moisture, such as OLED displays.
Oxygen permeability： 390/cm3/（m2・24hr・atm） or less *Thickness t50µm, 65℃/50%RH
With its excellent low oxygen permeability, the material can be applied to devices affected by oxygen.
Cross-sectional photo of unevenness-filling test: Adhesion and setting occurs while filling uneven areas
Temperature dependency of viscosity
＊All data are reference values, not guaranteed values.
Applications
Display
OLED Display
Wiring for 5G and Circuit Board
Wiring for 5G
Circuit Board
Cells and Batteries
Flexible solar cells
Contact Us
ICT Materials Business Division