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Semiconductor-Related Materials

Mitsui Chemicals offers a broad range of materials that support semiconductor manufacturing, including pellicles and wafer surface protection tapes with world-leading market shares. We provide optimal materials for every process, from front-end and back-end fabrication to packaging, substrates, and assembly, helping enhance semiconductor performance and reliability.

Leveraging our core technologies in organic synthesis, polymer design, purification, and adhesive engineering, we also provide solutions for AI semiconductors and advanced packaging applications. Through co-creation with customers, we support the evolution of next-generation devices with integrated capabilities ranging from material development to evaluation and analysis.

Mitsui Chemicals' Semiconductor-Related Materials

Front-end Process

In the front-end process of semiconductor manufacturing, we provide a wide range of semiconductor materials, chemical materials, and process materials for key processes, including deposition, exposure, CMP, and cleaning.

Front-end Process
Front-end Process

Back-end and Mounting process

In the Back-end and Mounting process of semiconductor manufacturing, we provide a wide range of packaging materials for wafer back-grinding, dicing, bonding, and molding, as well as for semiconductor package substrate manufacturing, resin substrate manufacturing processes including exposure, and lamination, multilayer ceramic capacitor (MLCC) manufacturing, and device assembly processes.

Back-end and Packaging process
Back-end and Packaging process

Product Portfolio

Front-end Process

Silane Gases

CVD gases for silicon film formation for low-temperature, high-throughput deposition processes

シランガス

Alkylaluminium (Nippon Aluminum Alkyls, Ltd)

Organometallic precursors used for semiconductor thin-film deposition

アルキルアルミニウム

MILEX™

Phenols (Honshu Chemical Industry Co., Ltd.)

Phenol-based materials for semiconductor photoresists

ミレックス™、フェノール群(本州化学工業(株))

MITSUI PELLICLE™

Photomask dust covers that achieve high transmittance and long service life through optimized membrane design, contributing to improved yield and productivity

三井ペリクル™

SYNTEX™ nano (Mitsui Chemicals Asahi Life Materials Co., Ltd.)

Nonwoven filtration media enabling highly precise filtration of CMP slurries and electronic-component pastes

シンテックス®nano

FORTIMO™ TAKENATE™

Polyurethane resins for CMP polishing pads with excellent chemical resistance and long service life

フォルティモ®  タケネート®

Alkyl anthraquinones (Yamamoto Chemicals, Inc.)

Catalysts for hydrogen peroxide production used in semiconductor cleaning processes

アルキルアントラキノン

Back-end and Mounting process

PIVAR™ *Under Development

Temporary bonding adhesive for wafer support systems with excellent heat resistance

ピバール™ ※開発品

ICROS™ Tape (Mitsui Chemicals ICT Materia, Inc.)

Protective tapes for wafer surfaces during the back-grinding process

イクロステープ™  ( 三井化学ICTマテリア(株))

ICROS™ Tape (Mitsui Chemicals ICT Materia, Inc.)

Tapes for securing chips during the dicing process

イクロステープ™  ( 三井化学ICTマテリア(株))

Paltref™ *Under Development

Fluorine-free thin release films with excellent heat resistance and heat transfer performance for bonding processes above 300°C

Paltref™ ※開発品

Bonding Materials *Under Development

Insulating adhesive materials that enable low-temperature, high-precision bonding between chips during Cu-Cu hybrid bonding in advanced semiconductor packages such as HBM and chiplets

接合材 ※開発品

Co-Packaged Optics (CPO) Materials  *Under Development

Materials for next-generation communication devices, including polymer optical waveguide materials and transparent adhesives, enabling the integration of photonic and electronic ICs

光電融合パッケージ向け材料 ※開発品

ICROS™ Tape (Mitsui Chemicals ICT Materia, Inc.)

Zero-stress debonding tapes for temporary fixation during semiconductor molding processes

熱剥離粘着テープ (三井化学ICTマテリア(株))

Gigafreq™ *Under Development

Low-dielectric resin materials for high-frequency substrates and insulating films

ギガフリーク™ ※開発品

Specialty Bisphenols (Honshu Chemical Industry Co., Ltd.)  

Resin monomers providing low dielectric constant and low loss characteristics for high-speed communication substrates

ギガフリーク™ ※開発品

MITSUI PELLICLE™

Photomask dust covers that achieve high transmittance and long service life through optimized membrane design, contributing to improved yield and productivity

三井ペリクル™

Opulent™ (Mitsui Chemicals ICT Materia, Inc.)

Process films for FPC and PCB lamination with excellent heat resistance and release properties

オピュラン™ (三井化学ICTマテリア(株))

SYNTEX™ nano (Mitsui Chemicals Asahi Life Materials Co., Ltd.)

Nonwoven filtration media enabling highly precise filtration of ceramic slurries used in MLCC production and related materials

シンテックス®nano

SP-PET™ (Mitsui Chemicals ICT Materia, Inc.)

Silicone-coated release films for ceramic sheet forming in MLCC manufacturing

SP-PET™ (三井化学ICTマテリア(株))

Mitsui Masking Tape™ (Mitsui Chemicals ICT Materia, Inc.)

Surface protection tapes for electronic components using environmentally friendly water-based adhesives

三井マスキングテープ™ (三井化学ICTマテリア(株))

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ICT Solutions Business Sector Planning & Coordination Division