Struct Bond™ Relevant Products
- Basic information
- Details of Characteristics
- Details of Applications
A sealing material (single-component adhesive) for displays. The lineup includes a heat-curing type and combination UV + heat-curing type.
Low moisture permeability
Possesses excellent moisture permeability and high reliability.
High adhesive strength
In addition to high adhesion to inorganic materials such as glass, the material also displays good adhesion to organic materials such as organic films.
Low liquid crystal pollution
Shows minimal elution of components into liquid crystal and good liquid crystal panel display properties.
Various manufacturing processes
Various manufacturing processes including screen printing and dispensers are supported.
Long pot life
Excellent viscosity stability at room temperature ensures a long working life.
Heat-cured sealant for injection process
UV + heat-cured sealant for one drop fill (ODF)
Details of properties
|Heat-cured sealant for LCD||UV+heat-cured sealant for LCD||Appendix|
|Resin type||With solvent
Acryl + Epoxy
|Curing process||90℃ 10min + 150℃ 60min||UV3,000mJ/cm2 + 120℃ 60min||-|
|Grade||Standard||High reliability||Standard||High adhesion||-|
|Viscosity rising rate||times||1.7||1.3||1.1||1.1||Compared with initial viscosity
after 7days at 23℃
|TI value||-||1.2||1.1||1.1||1.1||1.0/10 rpm vis. ratio|
|Adhesive strength||N/mm||20||18||21||25||Line width 0.5mm on Glass|
All data are reference values, not guaranteed values.
Curability at light shielded area （UV + heat-cured sealant for liquid crystal）
Shows excellent UV curing performance under wiring, even in areas not directly irradiated by UV.