Struct Bond™ Relevant Products
A high performance adhesive with excellent properties including high adhesion and high heat resistance.
- Basic information
- Details of Characteristics
- Details of Applications
The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin.
Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type and shape of the adhesion substrate.
Mitsui Chemicals, Inc can also propose total solutions that include the investigation and analysis of various defects related to adhesion.
Through a stress-absorbing design, Struct Bond™ exhibits high adhesion on various substrates including metals and ceramics.
High Heat resistance
Through a design that improves heat resistance, Struct Bond™ can be used in high-temperature environments for extended periods.
Room temperature curability (two-component mixed type)
Room temperature curing is possible with the two-component mixed type. This enables on-site processing and adhesion to substrates that are difficult to heat up.
Details of properties
|Epoxy||High heat resistance(220℃)|
|Epoxy||High adhesive strength, shock resistance|
|Epoxy||High heat resistance(200℃), room temperature curing|
|Epoxy||High heat resistance(200℃), room temperature curing, low viscosity|
|Epoxy||High heat resistance(150℃), room temperature curing|
|Epoxy||High heat resistance(150℃), room temperature curing, low viscosity|
|Epoxy||High heat resistance(150℃), abrasion resistance (joints), room temperature curing|
|Epoxy||Room temperature curing|
|Primer||Epoxy type primer, rustproof|
|Silicone||High heat resistance(250℃), shock resistance, room temperature curing|