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Struct Bond™
Functional adhesive
Struct Bond™ Relevant Products
A high performance adhesive with excellent properties including high adhesion and high heat resistance.
Usage detail
Adhesive with high adhesion and high heat resistance.
Usage
Characteristic
- Weather resistance
- Basic information
- Details of Characteristics
- Details of Applications
Overview
The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin.
Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type and shape of the adhesion substrate.
Mitsui Chemicals, Inc can also propose total solutions that include the investigation and analysis of various defects related to adhesion.

Features
High Adhesion
Through a stress-absorbing design, Struct Bond™ exhibits high adhesion on various substrates including metals and ceramics.
High Heat resistance
Through a design that improves heat resistance, Struct Bond™ can be used in high-temperature environments for extended periods.
Room temperature curability (two-component mixed type)
Room temperature curing is possible with the two-component mixed type. This enables on-site processing and adhesion to substrates that are difficult to heat up.
Features
Details of properties
Grade | Cure type | Type | Features |
---|---|---|---|
E-413A | Single-component heat-curing |
Epoxy | High heat resistance(220℃) |
X-8100L | Single-component heat-curing |
Epoxy | High adhesive strength, shock resistance |
EH-456 | Two-component mixed |
Epoxy | High heat resistance(200℃), room temperature curing |
EH-455NF | Two-component mixed |
Epoxy | High heat resistance(200℃), room temperature curing, low viscosity |
EH-454NA | Two-component mixed |
Epoxy | High heat resistance(150℃), room temperature curing |
EH-454NF | Two-component mixed |
Epoxy | High heat resistance(150℃), room temperature curing, low viscosity |
400HNA | Two-component mixed |
Epoxy | High heat resistance(150℃), abrasion resistance (joints), room temperature curing |
EW-460NA | Two-component mixed |
Epoxy | Room temperature curing |
PM-21A | Two-component mixed |
Primer | Epoxy type primer, rustproof |
8310 | Two-component mixed |
Silicone | High heat resistance(250℃), shock resistance, room temperature curing |
Adhesion Strength and Heat Resistance Design

Applications






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