Struct Bond™

Functional adhesive

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Struct Bond™ Relevant Products

A high performance adhesive with excellent properties including high adhesion and high heat resistance.

Usage detail

Adhesive with high adhesion and high heat resistance.

Usage

Characteristic

  • Weather resistance
  • Basic information
  • Details of Characteristics
  • Details of Applications

Overview

The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin.
Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type and shape of the adhesion substrate.

Mitsui Chemicals, Inc can also propose total solutions that include the investigation and analysis of various defects related to adhesion.

Struct Bond™ Functional adhesive

Features

High Adhesion

Through a stress-absorbing design, Struct Bond™ exhibits high adhesion on various substrates including metals and ceramics.

High Heat resistance

Through a design that improves heat resistance, Struct Bond™ can be used in high-temperature environments for extended periods.

Room temperature curability (two-component mixed type)

Room temperature curing is possible with the two-component mixed type. This enables on-site processing and adhesion to substrates that are difficult to heat up.

Features

Details of properties
Grade Cure type Type Features
E-413A Single-component
heat-curing
Epoxy High heat resistance(220℃)
X-8100L Single-component
heat-curing
Epoxy High adhesive strength, shock resistance
EH-456 Two-component
mixed
Epoxy High heat resistance(200℃), room temperature curing
EH-455NF Two-component
mixed
Epoxy High heat resistance(200℃), room temperature curing, low viscosity
EH-454NA Two-component
mixed
Epoxy High heat resistance(150℃), room temperature curing
EH-454NF Two-component
mixed
Epoxy High heat resistance(150℃), room temperature curing, low viscosity
400HNA Two-component
mixed
Epoxy High heat resistance(150℃), abrasion resistance (joints), room temperature curing
EW-460NA Two-component
mixed
Epoxy Room temperature curing
PM-21A Two-component
mixed
Primer Epoxy type primer, rustproof
8310 Two-component
mixed
Silicone High heat resistance(250℃), shock resistance, room temperature curing
Adhesion Strength and Heat Resistance Design
Adhesion Strength and Heat Resistance Design

Applications

Ceramic tile adhesion
Ceramic tile adhesion
Ceramics component adhesion
Ceramics component adhesion
Automotive component adhesion
Automotive component adhesion
Grindstone adhesion
Grindstone adhesion
Magnet adhesion
Magnet adhesion
Heat resistant plastic adhesion
Heat resistant plastic adhesion

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