Struct Bond™

The Struct Bond™ is a high adhesion, high heat resistant high-performance adhesive designed based on epoxy or silicone resin.
Two types are available, a single-component heat-curing type and two-component mixed curing type, which can be selected based on the type and shape of the adhesion substrate.

Mitsui Chemicals, Inc can also propose total solutions that include the investigation and analysis of various defects related to adhesion.

High Adhesion

Through a stress-absorbing design, Struct Bond™ exhibits high adhesion on various substrates including metals and ceramics.

High Heat resistance

Through a design that improves heat resistance, Struct Bond™ can be used in high-temperature environments for extended periods.

Room temperature curability (two-component mixed type)

Room temperature curing is possible with the two-component mixed type. This enables on-site processing and adhesion to substrates that are difficult to heat up.

Details of properties

Grade	Cure type	Type	Features
E-413A	Single-component heat-curing	Epoxy	High heat resistance(220℃)
X-8100L	Single-component heat-curing	Epoxy	High adhesive strength, shock resistance
EH-456	Two-component mixed	Epoxy	High heat resistance(200℃), room temperature curing
EH-455NF	Two-component mixed	Epoxy	High heat resistance(200℃), room temperature curing, low viscosity
EH-454NA	Two-component mixed	Epoxy	High heat resistance(150℃), room temperature curing
EH-454NF	Two-component mixed	Epoxy	High heat resistance(150℃), room temperature curing, low viscosity
400HNA	Two-component mixed	Epoxy	High heat resistance(150℃), abrasion resistance (joints), room temperature curing
EW-460NA	Two-component mixed	Epoxy	Room temperature curing
PM-21A	Two-component mixed	Primer	Epoxy type primer, rustproof
8310	Two-component mixed	Silicone	High heat resistance(250℃), shock resistance, room temperature curing